A gel-form potting/encapsulation fire suppression material with microcapsules dispersed in a specialty adhesive matrix, combining adhesive fixation with automatic fire suppression. Fills gaps between battery cells, battery packs, and electrical equipment, replacing conventional potting compounds. Phase-change heat absorption plus automatic suppression inhibits temperature rise and blocks thermal runaway, with excellent adhesion, 1000V voltage resistance, suited to high-voltage applications.
| Parameter | Specification |
|---|---|
| Form Factor | Gel (paste/semi-fluid) |
| Color | Brown |
| Surface Drying Time | 20–30 min |
| Viscosity | 200,000 mPa·s |
| Trigger Temperature | 130±10°C |
We can provide selection guidance and sample support tailored to your specific use case.
